Reticle Processing System

ABSTRACT

Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.15/140,633, filed Apr. 28, 2016, the entire disclosure of which ishereby incorporated by reference herein.

FIELD OF THE DISCLOSURE

Embodiments of the present disclosure relate generally to lithographyreticle blank processing and, more specifically, to a customized supportassembly and associated method for processing lithography reticle blanksusing the support assembly.

BACKGROUND OF THE DISCLOSURE

Extreme ultraviolet lithography (EUV), also known as soft x-rayprojection lithography, has begun to replace deep ultravioletlithography for the manufacture of 0.13 micron, and smaller, minimumfeature size semiconductor devices. EUV systems operate by reflectioninstead of transmission of light. Through the use of a series ofmirrors, or lens elements, and a reflective element, or mask blank,coated with a non-reflective absorber mask pattern, patterned actiniclight is reflected onto a resist-coated semiconductor wafer.

Conventional EUV blank processes may include, for example, a 152 mm×152mm blank reticle being placed into a coating tool to apply variouscoatings. As configured, the square reticle is sandwiched within acarrier assembly (e.g., a 300 mm carrier assembly) to enable the reticleto be transferred through the coating tool like a 300 mm wafer. Thecarrier assembly may include a carrier base, the reticle blank, and acarrier shield.

During processing, every time the reticle blank is transported into thecoating tool, the elements of the carrier assembly are brought togetherand separated apart. This process involves multiple lifts and clamps forseparating the carrier base and the carrier shield so a reticle can beplaced therebetween. The lifts can be extended or retracted to open orclose the carrier assembly. However, this approach is undesirablebecause multiple lifting and clamping components are provided near thereticle, thus increasing the possibility particles are generated.Furthermore, current techniques undesirably place the reticle in anenclosure, as opposed to directly in a clean FI-robot mini environment,use one of the few loadport positions available on the front of the FI,and reduce accuracy placement for the carrier assembly because the FIneeds to pick-up the carrier assembly from multiple modules, thusincreasing the likelihood of a placement error.

SUMMARY OF THE DISCLOSURE

In view of the foregoing, an advantage of the present disclosure is toprovide a customized support assembly including a plate coupled to aframe, the plate including a plurality of pins extending from the platethrough corresponding openings in a carrier base of a carrier assemblyto individually support and vertically separate the components of thecarrier assembly during processing. Moreover, an advantage of thepresent disclosure is to provide a system and method for assembling anddisassembling the carrier assembly to minimize production of harmfulparticles.

An exemplary reticle processing system in accordance with the presentdisclosure may include a support assembly having a plate coupled to aframe, and a carrier assembly coupled to the support assembly. Thecarrier assembly may include a carrier base coupled to the plate, areticle disposed over the carrier base, and a carrier shield disposedover the reticle, the carrier shield including a central opening foraccess to the reticle.

An exemplary reticle carrier in accordance with the present disclosuremay include a carrier assembly including a carrier base coupled to theplate, a reticle disposed over the carrier base, and a carrier shielddisposed over the reticle, the carrier shield including a centralopening allowing access to the reticle. The reticle carrier may furtherinclude a support assembly including a plate coupled to a frame, and aplurality of pins extending from a top surface of the plate throughcorresponding openings in the carrier base, the plurality of pinssupporting the carrier assembly so the carrier base is verticallyseparated from the plate by a first gap, the reticle is verticallyseparated from the carrier base by a second gap, and the carrier shieldis vertically separated from the reticle by a third gap.

An exemplary method of processing a reticle blank in accordance with thepresent disclosure may include providing a carrier assembly including acarrier base, a carrier shield, and a reticle blank. The method mayfurther include depositing the carrier base and the carrier shield atopa support assembly, the support assembly including a plate coupled to aframe. The method may further include depositing a reticle blank withinan opening of the carrier shield, and removing the carrier assembly fromthe support assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic of an exemplary coating tool in accordance withcertain aspects of the present disclosure.

FIG. 2 is a perspective view of a reticle processing system inaccordance with certain aspects of the disclosure.

FIG. 3 is a side view of the reticle processing system of FIG. 2 inaccordance with certain aspects of the disclosure.

FIG. 4 is an exploded perspective view of the reticle processing systemof FIG. 2 in accordance with certain aspects of the disclosure.

FIG. 5 is a perspective view of a support assembly of the reticleprocessing system of FIG. 2 in accordance with certain aspects of thedisclosure.

FIG. 6 is a top view of a carrier base of the reticle processing systemof FIG. 2 in accordance with certain aspects of the disclosure.

FIG. 7 is a side cross-sectional view of the reticle processing systemof FIG. 2 in accordance with certain aspects of the disclosure.

FIGS. 8A-8B are front and side views, respectively, of a support pinused with the reticle processing system of FIG. 2 in accordance withcertain aspects of the disclosure.

FIG. 9 is a flowchart illustrating an exemplary method for processing areticle according to the present disclosure.

FIG. 10 is a flowchart illustrating an exemplary method for operatingthe reticle processing system of FIG. 2 according to the presentdisclosure.

The drawings are not necessarily to scale. The drawings are merelyrepresentations, not intended to portray specific parameters of thedisclosure. Furthermore, the drawings are intended to depict exemplaryembodiments of the disclosure, and therefore is not considered aslimiting in scope.

Furthermore, certain elements in some of the figures may be omitted, orillustrated not-to-scale, for illustrative clarity. The cross-sectionalviews may be in the form of “slices”, or “near-sighted” cross-sectionalviews, omitting certain background lines otherwise visible in a “true”cross-sectional view, for illustrative clarity. Furthermore, forclarity, some reference numbers may be omitted in certain drawings.

DETAILED DESCRIPTION

Various approaches in accordance with the present disclosure will now bedescribed more fully hereinafter with reference to the accompanyingdrawings, where embodiments of the methods are shown. The approaches maybe embodied in many different forms and are not to be construed as beinglimited to the embodiments set forth herein. Instead, these embodimentsare provided so this disclosure will be thorough and complete, and willfully convey the scope of the system and method to those skilled in theart.

For the sake of convenience and clarity, terms such as “top,” “bottom,”“upper,” “lower,” “vertical,” “horizontal,” “lateral,” and“longitudinal” will be used herein to describe the relative placementand orientation of these components and their constituent parts withrespect to the geometry and orientation of a component of a device asappearing in the figures. The terminology will include the wordsspecifically mentioned, derivatives thereof, and words of similarmeaning and/or significance.

As used herein, an element or operation recited in the singular andproceeded with the word “a” or “an” is to be understood as includingplural elements or operations, until such exclusion is explicitlyrecited. Furthermore, references to “one embodiment” of the presentdisclosure are not intended as limiting. Additional embodiments may alsoincorporate the recited features.

As stated above, provide herein are approaches for processing reticleblanks. In one approach, a reticle processing system includes a supportassembly having a plate coupled to a frame, and a carrier assemblycoupled to the support assembly. The reticle processing system describedherein may reside in a “clean” laminar flow region of a mini-environmentinstead of, for example, a stand-alone pod having no laminar flow andoccupying one of the loadport positions. In one approach, the carrierassembly includes a carrier base coupled to the plate, a reticledisposed over the carrier base, and a carrier shield disposed over thereticle, wherein the carrier shield has a central opening formedtherein, providing ingress/egress for the reticle. In one approach, whenthe carrier assembly is placed atop the support assembly, a plurality ofpins extend from the plate through corresponding openings in the carrierbase, the plurality of pins supporting the carrier assembly so thecarrier base, the reticle, and the carrier shield are each independentlysupported and vertically separated from one another.

With reference now to the figures, FIG. 1 depicts an EUV mask productionsystem 100. The EUV mask production system 100 may include a mask blankloading and carrier handling system 102 receiving one or more maskblanks 104. An airlock 106 provides access to a wafer handling vacuumchamber 108. In the embodiment shown, the wafer handling vacuum chamber108 contains two vacuum chambers, e.g., a first vacuum chamber 110 and asecond vacuum chamber 112. Within the first vacuum chamber 110 is afirst wafer handling system 114, and in the second vacuum chamber 112 isa second wafer handling system 116.

The wafer handling vacuum chamber 108 may have a plurality of portsaround its periphery for attachment of various other systems. In thisnon-limiting embodiment, the first vacuum chamber 110 has a degas system118, a first physical vapor deposition system 120, a second physicalvapor deposition system 122, and a pre-clean system 124. Furthermore,the second vacuum chamber 112 may include a first multi-cathode source126, a flowable chemical vapor deposition (FCVD) system 128, a curesystem 130, and a second multi-cathode source 132 connected to it.

The first wafer handling system 114 is capable of moving wafers, such asa wafer 134, among the airlock 106 and the various systems around theperiphery of the first vacuum chamber 110 and through slit valves in acontinuous vacuum. The second wafer handling system 116 is capable ofmoving wafers, such as a wafer 136, around the second vacuum chamber112, while maintaining the wafers in a continuous vacuum. The integratedEUV mask production system 100 may operate with a reticle processingsystem described below.

Turning now to FIGS. 2-4, a reticle processing system in accordance withthe present disclosure will be described in greater detail. As shown,the reticle processing system 200 (hereinafter “system”) includes acarrier assembly 202 coupled to and supported by a support assembly 204.In one embodiment, the support assembly 204 includes a plate 208 coupledto a frame 210 extending partially along a periphery of the plate 208.As shown, the plate 208 may be coupled to the frame 210 by a set offasteners 212A-C extending through openings of the frame 210. Althoughnot limited to any particular type, the fasteners 212A-C may includenuts and bolts extending through the plate 208 and the frame 210,wherein a spring 214 is provided around the bolt to provideflexibility/resiliency to the fasteners 212A-C. As shown, the frame 210may have an L-shaped configuration, and the plate 208 a hexagonal shape,thus permitting the support assembly 204 to be secured to a cornerwithin a processing chamber. This configuration is non-limiting, asother geometries for the frame 210 and the plate 208 may be possibledepending on the specific application and processing environment.

As shown, the carrier assembly 202 includes a carrier base 218 and acarrier shield 220 respectively disposed below and above a reticle blank222. The carrier shield 220 includes a central opening 224 formedtherein to permit access to and ingress/egress of the reticle blank 222during processing. As shown the central opening 224 of the carriershield 220 is generally aligned over the reticle blank 222. In onenon-limiting approach, the reticle blank 222 is an EUV mask blank havingan ultra-low thermal expansion substrate of glass, silicon, or otherultra-low thermal expansion material. The ultra-low thermal expansionmaterials may include fused silica, fused quartz, calcium fluoride,silicon carbide, silicon oxide-titanium oxide alloy, or other materialhaving a thermal coefficient of expansion within the range of thesematerials.

Turning now to FIGS. 4-7, the support assembly 204 in accordance withthe present disclosure will be described in greater detail. As shown,the plate 208 includes a first set of pins 228A-C, a second set of pins230A-C, and a third set of pins 232A-C, each extending vertically, orgenerally vertically, from a top surface 234 of the plate 208. In oneembodiment, the second set of pins 230A-C is positioned closer to acenter section 238 of the plate 208 than the first set of pins 228A-C,and the first set of pins 228A-C is positioned closer to the centersection 238 of the plate 208 than the third set of pins 232A-C. In onenon-limiting approach, each of the first, second, and third sets of pins228A-C, 230A-C, and 232A-C are arranged in a triangular pattern forsupporting each component of the carrier assembly 202, while minimizingthe number of contact points between the plurality of pins and thecarrier assembly. One will appreciate the number and arrangement ofsupport pins is not limited to the embodiment shown.

Turning now to FIGS. 5-7, during operation, the support assembly 204receives the carrier assembly thereupon. More specifically, the carrierbase 218 is lowered onto the plate 208 causing the first set of pins228A-C to extend through a corresponding first set of openings 242A-Cwithin the carrier base 218. As shown, the first set of pins 228A-Cgenerally extend vertically higher than the second and third set of pins230A-C and 232A-C so as to come into contact with a bottom surface 244of the carrier shield 220 once assembled. The first set of pins 228A-Csupport and elevate the carrier shield 220 over the reticle 222. In oneembodiment, the first set of pins 228A-C each include a domed upper tip246 for minimally engaging the bottom surface 244 of the carrier shield220.

Furthermore, as the carrier base 218 is lowered on the plate 208, thesecond set of pins 230A-C extend through a corresponding second set ofopenings 250A-C within the carrier base and engage the reticle 222. Asshown, the second set of pins 230A-C generally extend vertically higherthan the third set of pins 232A-C, yet not as high as the first set ofpins 228A-C. Each of the second set of pins 230A-C includes an upperface 254 engaging a bottom surface 258 of the reticle 222 to support thereticle over the carrier base 218. In one embodiment, the upper face 254slopes downward towards the center section 238 of the plate 208.

Meanwhile, the third set of pins 232A-C engage the carrier base 218along a perimeter thereof, to support the carrier base 218 over theplate 208. More specifically, as shown in FIGS. 8A-8B, the third set ofpins 232A-C each include an upper seating surface 260 coupled to abacking section 262, for engaging a bottom surface 264 (FIG. 7) of thecarrier base 218. The backing section 262 is configured to limit lateralmovement of the carrier base 218 once the carrier base 218 is positionedupon the upper seating surface 260. Furthermore, the domed/convexprofile of the upper seating surface 260 may reduce surface area contactbetween the carrier base 218 and the third set of pins 232A-C, thusminimizing particle generation. The downward slope of the upper seatingsurface 260 towards the center section 238 of the plate 208 may enhancestability and placement accuracy of the carrier plate 218.

Turning again to FIG. 7, the plurality of pins 228A-C, 230A-C, and232A-C support the carrier assembly 202 so the carrier base 218, thereticle 222, and the carrier shield 220 are each independently supportedand vertically separated from one another. During use, when the carrierassembly 202 is placed on the support assembly 204, the components ofthe carrier assembly are not in direct contact with one another.Specifically, the plurality of pins support the components of thecarrier assembly 202 in a way so the carrier base 218 is verticallyseparated from the plate 208 by a first gap 268, the reticle 222 isvertically separated from the carrier base 218 by a second gap 270, andthe carrier shield 220 is separated from the reticle 222 by a third gap272. The placement and relative heights of the plurality of pins 228A-C,230A-C, and 232A-C, as well as the corresponding openings through thecarrier base 218, enable the demonstrated separation between componentsof the carrier assembly 202 when positioned atop the support assembly204.

In some embodiments, as further shown in FIG. 7, the system 200 mayinclude a sensor system 280 for aligning the carrier assembly 202 to thesupport assembly 204. For example, one or more sensors 282A-C are usedto verify whether each of the carrier assembly components (e.g., thecarrier shield 220, the reticle 222, or the carrier base 218) arecorrectly “in-position” on the support assembly 204. This also preventsa user from inadvertently placing the carrier assembly 202 or reticle222 on the support assembly 204 if one is already in position.

In one non-limiting embodiment, a first sensor 282-A monitors a firstscan area S1 for detecting a presence and placement of the carrier base218, a second sensor 282-B monitors a second scan area S2 for detectinga presence and placement of the reticle 222, and a third sensor 282-Cmonitors a third scan area S3 for detecting a presence and placement ofthe carrier shield 220. The sensors may transmit an output/feedback to aprocessor (not shown) of the sensor system 280 for subsequentanalysis/processing.

During operation, the sensor system 280 is used in conjunction with arobot (not shown), such as a factory interface (FI) robot, to accuratelyplace the carrier assembly 202, including the reticle 222, onto thecarrier assembly 202, where the carrier assembly 202 can be assembled ordis-assembled. Furthermore, the sensor system 280 is used to verify thecarrier assembly 202, including the reticle 222, are assembled correctlyprior to being delivered to the loadlock. Advantageously, the robot isthe sole moving component, ensuring the system 200 is not subject tounnecessary lifts or multiple robots, thus minimizing positional errors.For example, the vertical pick up and drop off trajectory of the robotis virtually identical, unlike when multiple, different lifts areemployed.

Turning now to FIGS. 9-10, respectively depicted are flow diagrams ofmethods for processing a reticle blank in accordance with certainaspects of the present disclosure. In some embodiments, the methods maybe implemented or instructed in part using a computer system. As such,the methods of FIGS. 9-10 may illustrate the functionality and/oroperation of possible implementations of systems, methods, and computerprogram products according to various embodiments of the presentdisclosure. In this regard, the blocks in the flowchart may represent amodule, segment, or portion of code, comprising one or more executableinstructions for implementing the specified logical function(s). As alsonoted, in some alternative implementations, the functions noted in theblocks might occur out of the order depicted in the figures. Forexample, two blocks shown in succession may, in fact, be executedconcurrently. As also noted, the blocks of the methods 300, 400 can beimplemented by special purpose hardware-based systems for performing thespecified functions or acts, or combinations of special purpose hardwareand computer instructions.

In one embodiment, as shown in FIG. 9, the method 300 may includeproviding a carrier assembly including a carrier base, a carrier shield,and a reticle blank, as shown at block 301. The method 300 may furtherinclude depositing the carrier base and the carrier shield atop asupport assembly, as shown at block 303. In some embodiments, thesupport assembly includes a plate coupled to a frame. In someembodiments, the method 300 at block 303 includes depositing the carrierassembly atop a plurality of pins extending from a top surface of theplate, wherein the plurality of pins support the carrier assembly so thecarrier base is vertically separated from the plate by a first gap, thereticle blank is vertically separated from the carrier base by a secondgap, and the carrier shield is vertically separated from the reticle bya third gap.

In some embodiments, the method 300 at block 303 may further includeidentifying a position of the carrier assembly using a sensor system,and depositing the carrier assembly atop the support assembly accordingto the identified position of the carrier assembly.

In some embodiments, the method 300 at block 303 may further includeproviding a first set of pins extending from a top surface of the platethrough a first set of openings in the carrier base, the first set ofpins in contact with a bottom surface of the carrier shield, andproviding a second set of pins extending from the top surface of theplate through a second set of openings in the carrier base. The method300 at block 303 further includes the second set of pins supporting thereticle over the carrier base, wherein the second set of pins ispositioned closer to a center section of the plate than the first set ofpins. The method 300 at block 303 further includes providing a third setof pins extending from the top surface of the plate, wherein the thirdset of pins is in contact with the carrier base to support the carrierbase over the plate, and wherein the first set of pins is positionedcloser to the center section of the plate than the third set of pins.The method 300 at block 303 may further include placing the carrier baseatop an upper shelf surface of the third set of pins, wherein the uppershelf surface has a domed profile sloping downward towards a center ofthe support assembly.

The method 300 further includes depositing the reticle blank within anopening of the carrier shield, as shown at block 305. In someembodiments, the reticle blank is deposited atop the second set of pinsextending from the plate.

The method 300 further includes removing the carrier assembly from thesupport assembly, as shown at block 307. In some embodiments, a robot ispositioned within the first gap formed between plate and the carrierbase, and the carrier assembly is then lifted upwards from the supportassembly, thus causing the carrier base, the carrier shield, and thereticle blank to compress and engage one another. The robot may thentransport the carrier assembly for further processing.

Turning now to FIG. 10, depicted is another flow diagram of a method 400for operating a reticle blank processing system in accordance withcertain aspects of the present disclosure. At block 401, a robot (e.g.,an FI robot) removes carrier assembly from the loadport and places thecarrier assembly on an aligner, where the carrier assembly is then notchaligned. At block 403, the robot removes the aligned carrier assemblyfrom the aligner and moves it to the sensor system. At block 405, whilethe carrier assembly is still on the robot blade, the sensor systemdetermines “correction offsets” for X, Y, and θ between the measuredcarrier assembly to a theoretical calibrated center X, Y, and θ of thecarrier assembly.

At block 407, the robot moves the carrier assembly from the sensorsystem to the support assembly. At block 409, the robot retracts fromthe support assembly when the carrier assembly is in an expandedconfiguration atop each of the plurality of pins. At block 411, thereticle is moved to the sensor system for measurement. At block 413,while still on the robot blade, the sensor system determines correctionoffsets for X, Y, and θ between the measured carrier assembly to atheoretical calibrated center X, Y, and θ of the carrier assembly withthe reticle. The sensor system also determines whether the reticle isup/down, as well as its orientation.

At block 415, the robot moves the reticle from the sensor system to thesupport assembly utilizing the correction offsets for X, Y, and θ. Atblock 417, the robot then retracts from the support assembly, leavingthe reticle on the second plurality of pins of the carrier assembly. Asconfigured, the reticle is suspended between the carrier base and thecarrier shield of the carrier assembly.

Next, at block 419, the robot moves beneath the carrier base and beginsto lift, picking up the carrier base, the reticle, and then the carriershield. As the robot moves upward, the carrier assembly collapses,causing the carrier base, the reticle, and the carrier shield to engageone another. For example, a top surface of the carrier base comes intocontact with a bottom surface of the reticle, and the reticle movesupwards within an opening of the carrier shield. At block 421, thesensor system verifies the carrier assembly and the reticle arepositioned within specified tolerance specifications. Once verified, atblock 423, the carrier assembly is moved to the loadlock (e.g., a singlewafer load lock (SWLL)).

A first advantage of the disclosure includes the elimination of multiplelifting and clamping mechanisms near the reticle, thus reducinggeneration of particles. A second advantage of the disclosure includesthe reticle being placed directly in a clean FI mini environment. Athird advantage is the elimination of at least one placement process,thus increasing accuracy of placement for the carrier assembly. A fourthadvantage of the disclosure is increased accuracy due to the additionalverification process after the robot picks up the carrier assembly.

While certain embodiments of the disclosure have been described herein,the disclosure is not limited thereto, as the disclosure is as broad inscope as the art will allow and the specification may be read likewise.Therefore, the above description is not to be construed as limiting.Instead, the above description is merely as exemplifications ofparticular embodiments. Those skilled in the art will envision othermodifications within the scope and spirit of the claims appended hereto.

1. A method of processing a reticle blank, the method comprising:providing a carrier assembly including a carrier base, a carrier shield,and a reticle blank; placing the carrier base and the carrier shieldatop a support assembly, the support assembly including a plate coupledto a frame; depositing the reticle blank within an opening of thecarrier shield; and removing the carrier assembly from the supportassembly.
 2. The method according to claim 1, further comprisingdepositing the carrier assembly atop a plurality of pins extending froma top surface of the plate, the plurality of pins supporting the carrierassembly so the carrier base is vertically separated from the plate by afirst gap, the reticle blank is vertically separated from the carrierbase by a second gap, and the carrier shield is vertically separatedfrom the reticle blank by a third gap.
 3. The method according to claim2, further comprising: positioning a robot within the first gap; andlifting, using the robot, the carrier assembly from the support assemblyto cause the carrier base, the carrier shield, and the reticle blank toengage one another.
 4. The method according to claim 1, furthercomprising: identifying a position of the carrier assembly using asensor system; and depositing the carrier assembly atop the supportassembly according to the identified position of the carrier assembly.5. The method according to claim 1, further comprising: placing thecarrier shield atop a first set of pins extending from a top surface ofthe plate through a first set of openings in the carrier base, whereinthe first set of pins support the carrier shield over the reticle;placing the carrier base atop a second set of pins extending from thetop surface of the plate through a second set of openings in the carrierbase, wherein the second set of pins support the reticle over thecarrier base; and placing the carrier base atop a third set of pinsextending from the top surface of the plate, wherein the third set ofpins support the carrier base over the plate.
 6. The method according toclaim 5, further comprising placing the carrier base atop an upperseating surface of the third set of pins, wherein the upper seatingsurface is convex and slopes downward towards a center section of theplate.
 7. The method according to claim 6, wherein the first set of pinsis positioned closer to the center section of the plate than the thirdset of pins.
 8. The method according to claim 5, further comprisingdepositing the reticle blank within an opening of the carrier shield. 9.The method according to claim 3, further comprising transporting thecarrier assembly with the robot for further processing.
 10. The methodaccording to claim 4, wherein the sensor system determines correctionoffsets for X, Y, and θ between the identified position of the carrierassembly and a theoretical calibrated center X, Y, and θ of the carrierassembly.
 11. The method according to claim 10, further comprising usinga robot to move the reticle from the sensor system to the supportassembly utilizing the correction offsets for X, Y, and θ.
 12. Themethod according to claim 11, further comprising retracting the robotfrom the support assembly, leaving the reticle on the second pluralityof pins of the carrier assembly so that the reticle is suspended betweenthe carrier base and the carrier shield of the carrier assembly.
 13. Themethod according to claim 12, further comprising moving the robotbeneath the carrier base and picking up the carrier base, the reticle,and then the carrier shield, causing the carrier base, the reticle, andthe carrier shield to engage one another.
 14. The method according toclaim 13, further comprising using the sensor system to verify that thecarrier assembly and the reticle are positioned within specifiedtolerance specifications.
 15. The method according to claim 14, furthercomprising moving the carrier assembly to a loadlock for furtherprocessing.
 16. The method according to claim 1, wherein the reticlecomprises an extreme ultraviolet blank, the method further comprisingmoving the extreme ultraviolet blank to at least one of a degas system,a first physical vapor deposition system, a second physical vapordeposition system, a pre-clean system, a first multi-cathode sourcesystem, a flowable chemical vapor deposition (FCVD) system, a curesystem, and a second multi-cathode source system.
 17. The methodaccording to claim 15, wherein the reticle comprises an extremeultraviolet blank, the method further comprising moving the extremeultraviolet blank to at least one of a degas system, a first physicalvapor deposition system, a second physical vapor deposition system, apre-clean system, a first multi-cathode source system, a flowablechemical vapor deposition (FCVD) system, a cure system, and a secondmulti-cathode source system.